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Intel Xeon X3480 - BV80605002505AH (BX80605X3480) information

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Type:CPU Manufacturer:Intel
family:Xeon microprocessors:Xeon 3400
Type CPU / Microprocessor
Market segment Server
Family
Intel Xeon 3400
Model number   
X3480
CPU part numbers
  • BV80*05002505AH is an OEM/tray microprocessor
  • BX80*05X3480 is a boxed microprocessor
Frequency    30** MHz
Turbo frequency 3*33 MHz (1 core)
3*00 MHz (2 cores)
3333 MHz (3 or 4 cores)
Bus speed    2.5 GT/s DMI
Clock multiplier    23
Package 115*-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.*5 cm x 3.*5 cm)
Socket Socket 115* / H1 / LGA115*
Introduction date May 30, 2010
End-of-Life date Last order date is December 28, 2012
Last shipment date for tray processors is December *, 2013
Price at introduction $*12
S-spec numbers
  ES/QS processors Production processors
Part number Q3M4 SLBPT
BV80*05002505AH + +
BX80*05X3480   +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Foxhollow-WS
Processor core    Lynnfield
Core stepping    B1 (Q3M4, SLBPT)
Manufacturing process 0.045 micron
**4 million transistors
Die size 2**mm2
Data width *4 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size    4 x 25* KB 8-way set associative caches
Level 3 cache size 8 MB 1*-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • EM*4T / Extended Memory *4 technology / Intel *4   
  • VT-x / Virtualization technology   
  • VT-d / Virtualization for directed I/O
  • NX / XD / Execute disable bit   
  • TBT / Turbo Boost technology   
  • TXT / Trusted Execution technology
  • HT / Hyper-Threading technology   
Low power features
  • Thread C1/C1E, C3 and C* states
  • Core C1/C1E, C3 and C* states
  • Package C1/C1E, C3 and C* states
  • Enhanced SpeedStep technology   
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-10**, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes
Other peripherals
  • Direct Media Interface
  • PCI Express 2.0 interface
Electrical / Thermal parameters
V core    0.*5V - 1.4V
Maximum operating temperature    *2.*°C
Thermal Design Power    *5 Watt


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